Cosiatec Solutions exudes dynamism in providing software consultancy, human capital solutions, executive search services and professional recruitment solutions serving the fast growing specialized segments of information technology, semiconductor, microelectronics, biomedical, banking &financial institutions in Asia Pacific.
Our client a leading manufacturer of Integrated circuits is currently seeking a Substrate Design Engineer.
Duties and Responsibilities:
Interface with silicon design groups to generate substrate / package requirement specification.
Prepare required substrate / chip package documentation .
Prepare required substrate / chip package documentation .
Interface with substrate manufacture / packaging house.
Manage substrate / chip package schedule in line with silicon schedule.
Manage and maintain substrate / package drawing documentations.
Constantly seeking cost effective solutions.
Occasional travel.
Required skills / experience:.
Hands on experience in designing Hi-Speed digital / analog PCB. (5 years)
Hands on experience in using various PCB designing tools. (6 years)
Solid understanding of silicon design process / cycle
Solid understanding of PCB manufacturing process / cycle / materials
Solid understanding of Hi-Speed system issues (EMI, reflection, crosstalk, slew rate)
Added skills/ Experience:
Hands on experience in designing substrate.
Previous relation / connection with packaging houses
Hi-Speed memory interface system / PCB design experience.
Hi-Speed analog system / PCB design experience
Please email your detailed resume in word format and indicate last drawn salary & expected salary to: resumes@cosiatec.com
Only shortlisted candidates will be notified.
All information will be treated with strictest confidence.
CosiaTec maintains a strict confidentiality policy on all personal data submitted by all candidates and is committed to the protection of their personal information. CosiaTec will not release such information to anyone without the prior consent of the candidates.
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